This Ultrasonic Grinder applies for rubbing and polishing diamond die and mono diamond die,the new technology is rapidly extend and use in the global.
UPM-250 ultrasonic grinder is designed for repair and polish diamond and artificial diamond drawing die range from 0.3 to 8.0mm.
The great improvement lies in:the rotated auto swing structure,generator adopts transistor so as to improve power output.
To improve ultrasonic transducer design.Direct wind cooling improves product environment.
Technical parameter
1.input power:220V 50±2Hz
2.working frequency range:20KHz
3.consume power:≤500W
4.transducer:piezoelectricity wafter,wind cool
5.adding pressure method:use fluid drive,weight to add pressure
6.working rotate speed:123 turn/ min
7.working rotate speed:around 30 turn/ min
8.working angle:not smaller than 120,ADJUSTABLE.
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